Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03G5-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
filingDate |
1992-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b1d3d1b364a01ae7be164af54b7fb68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c002b2880fff5a13335ae2e05e378516 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35a5d16e604762de06be94f2ee95e032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_711f1cb233fbf4d67294605d92e31b64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5fe2fe8d5fea874aec3ba2d5e38b5c9d |
publicationDate |
1993-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-H05323625-A |
titleOfInvention |
Photosensitive heat resistant resin composition |
abstract |
(57) [Summary] [Purpose] The objective is to obtain a resin composition having excellent photosensitivity and heat resistance. In order to achieve the above object, the composition of the present invention comprises a polyimide precursor varnish having no self-photosensitivity, an acrylic monomer having good compatibility with the varnish and excellent heat resistance after curing. It is composed of an oligomer and a photoinitiator of imidazole dimer system. With this structure, a heat-resistant insulating film having high sensitivity and excellent film quality can be obtained extremely economically. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022210315-A1 |
priorityDate |
1992-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |