http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05322969-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f187eb8cb31e70d4acd428dd8beedd4f
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
filingDate 1992-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d206bba0e60fe444d5f5a3647b3465a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ee087bccd2b36a7122d928acb53b2a6
publicationDate 1993-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05322969-A
titleOfInvention Method of applying thermal shock to electronic parts, method of thermal shock test, and apparatus for applying thermal shock used therefor
abstract (57) [Abstract] [Purpose] It is possible to give a thermal shock in the electronic component manufacturing stage that imitates the severe thermal shock given when the user performs the soldering process with a simple configuration. With the goal. [Structure] The manufacturing frames F 1 and F 2 carrying a plurality of electronic components at predetermined intervals are rapidly heated by a heating means 5 using electromagnetic waves, and then kept at a constant temperature for a predetermined time by a heat retaining means 4. It is characterized by having done. Manufacturing frame F 1 , F 2 by high energy radiant heating by electromagnetic waves Is heated rapidly and uniformly, and is maintained at this rapidly heated temperature for a certain period of time, so it is possible to properly imitate the thermal shock that occurs during soldering, and moreover, silicone oil and fluorocarbon for cleaning it. The cleaning process using is completely unnecessary, the apparatus is simplified, and the cost can be reduced.
priorityDate 1992-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 18.