http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05319903-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d6402b23ab8782152be47b3996e48a4a |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-632 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L25-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F3-02 |
filingDate | 1992-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd9c1deeff2fd49f9bd9d834ec332258 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c493c65f0eaee681e41a49fafde38678 |
publicationDate | 1993-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H05319903-A |
titleOfInvention | Binder and composition for sinterable powder injection molding |
abstract | (57) [Summary] [Purpose] Excellent in moldability and strength using a sinterable powder injection molding binder containing a (co) polymer having a molecular weight of more than 2000 and having one or more epoxy groups in the molecule. And a sinterable powder injection molding composition. A binder for sinterable powder injection molding containing a (co) polymer having a molecular weight of more than 2,000 and having one or more epoxy groups in the molecule, particularly, the above-mentioned polymer and a binder other than the above-mentioned polymer ) A sinterable powder injection molding binder containing a polymer and an organic compound having a molecular weight of 2000 or less. (A) 3 to 80% by weight of a (co) polymer having a molecular weight of more than 2000 and having at least one epoxy group in the molecule, (b) 70% by weight or less of a polymer other than the above (a), and ( c) A composition for powder injection molding of metal powder, ceramic powder or cermet powder, using a sinterable powder injection molding binder containing 20 to 80% by weight of an organic compound having a molecular weight of 2000 or less. Furthermore, it is preferable that the various powders have an average particle diameter of 0.01 to 1000 μm. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007137939-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115043644-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002206124-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012007212-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140138952-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013204121-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10240032-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013204119-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015516019-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015516018-A |
priorityDate | 1992-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 236.