| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d9cb217f83556ce2a418344c2d485415 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 |
| filingDate |
1992-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69f93b6a136f4c53b95f876710b67ca9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e57320308832e32df5004db7f140253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adb49f567d13e482aacbf732e5193541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbc009884a44ecb7fdcb87f50a2f08fb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4c2f62e938f463b27c047824e613320 |
| publicationDate |
1993-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H05311147-A |
| titleOfInvention |
Heat resistant adhesive |
| abstract |
(57) [Summary] (Modified) [Structure] (a) 100 parts by weight of a specific polyimide siloxane, (b) 1 to 60 parts by weight of an epoxy-polyoxyalkylene-modified polysiloxane compound, (c) others having an epoxy group Of the epoxy compound, 15 to 250 parts by weight, and (d) the epoxy curing agent as a resin component. [Effect] Since the copper foil and the heat-resistant film can be laminated together, the laminated body thus laminated has a sufficient adhesive force of the adhesive layer and further exhibits excellent flexibility and heat resistance. It can be used for manufacturing flexible wiring boards and copper-clad boards for TAB. Furthermore, heat resistance (adhesiveness at 150 ° C or higher) and flexibility (flexibility) even after heat curing of the laminate. The curl of the film after the copper foil of the laminate is removed by etching is small, so that it is particularly suitable as an adhesive for flexible wiring boards and copper-clad boards for TAB. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5773509-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109705798-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109705800-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200062658-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05339555-A |
| priorityDate |
1992-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |