http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05310957-A

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filingDate 1992-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ded1f11ec9e626dd3bcb21fe8f964347
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publicationDate 1993-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05310957-A
titleOfInvention Fiber sheet and circuit board using the same
abstract (57) [Summary] [Purpose] Taking advantage of the excellent high-frequency characteristics, low hygroscopicity, and flame retardancy of polyphenylene sulfide, it is also excellent in heat resistance and processability as a circuit board, as well as high-speed signal processing and high-frequency processing. An insulating base material and a circuit board (including a multilayer circuit board) suitable for a required circuit board are provided. [Constitution] Dielectric constant at a frequency of 1 MHz is 5. Fibrous substance (A) having a dielectric loss of 0 or less and 0.02 or less And a resin composition (B) containing polyphenylene sulfide as a main component, the fiber sheet having a heat shrinkage ratio at 250 ° C. of 1.0% or less, and at least one surface of the fiber sheet. A circuit board with an electric circuit.
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