http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05306385-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_85b8866515dbcc7446fd619c61db9483 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J129-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J177-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J177-00 |
| filingDate | 1992-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0777e3c02bb2197d7bde6a05ec48fa9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c9f93f3277815fabace792b2386e9ec http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77630d93d4b87bf699c294eebc2dee69 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4f7bb8a5bcd020251ce167f1412dd1d |
| publicationDate | 1993-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05306385-A |
| titleOfInvention | Adhesive composition |
| abstract | (57) [Summary] [Purpose] TAB (Tape Automated B is an adhesive for bonding an insulating resin film of a film carrier tape and a copper foil in an onding technology, and is adhesive strength, electrical insulation, chemical resistance in a chemical etching process or a process of plating tin or gold, solder. Provided is an adhesive composition which has excellent heat resistance and a small resin flow. [Structure] Polyamide resin (component A) having a weight average molecular weight of 5,000 to 100,000 containing dimer acid and an aliphatic diamine as main raw materials, butyral resin (component B) having an average degree of polymerization of 1,000 to 2,400, and an epoxy group in one molecule. 2 It is mainly composed of epoxy resin (C component) having at least one, and the proportions of A component, B component and C component are 10 to 70% by weight, 5 to 50% by weight and 25 to 65% by weight, respectively, with respect to the total amount thereof. An adhesive composition comprising a mixed resin component in the range of which the total amount of A component and B component accounts for 35 to 75% by weight, a curing agent and a curing accelerator. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102408857-A |
| priorityDate | 1992-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.