http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0529739-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_32df1f25edbf7933e35d2304d2190f77 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B7-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1991-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88f41b765436a32c3592ce20abdda622 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adf1af3e21beb45e97689e58b8c83526 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9569829cc450590c0eb5785ff0df3fe2 |
| publicationDate | 1993-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0529739-A |
| titleOfInvention | Flexible printed circuit board |
| abstract | (57) [Summary] (Modified) [Purpose] To improve the electrical conductivity by increasing the adhesion of jumper circuits, through-hole circuits, and electromagnetic wave shields to the circuit pattern, and to improve the bending resistance. [Structure] The circuit pattern 1 contains at least one of Fe and Mg, at least one of P and B, and In, and the balance is substantially copper. The circuit pattern 1 has excellent bending resistance and is more conductive than pure copper. It is formed from a copper alloy rolled and annealed foil that is comparable to the above. The electromagnetic wave shield 7 and the jumper circuit 6 are formed of a conductive coating material containing metal copper powder, a resol-type phenol resin, a chelate layer forming agent, an adhesion improving agent, and a conductivity improving agent, which are surface-coated with titanate. The through-hole circuits 5a and 5b are formed of a conductive coating material, which is surface-coated with titanate, and which contains metal copper powder, a resol type phenol resin, an amino compound, and a chelate layer forming agent. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002184245-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5409776-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5296651-A |
| priorityDate | 1991-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 71.