http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0529737-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_32df1f25edbf7933e35d2304d2190f77 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B7-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1991-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9569829cc450590c0eb5785ff0df3fe2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adf1af3e21beb45e97689e58b8c83526 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88f41b765436a32c3592ce20abdda622 |
| publicationDate | 1993-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0529737-A |
| titleOfInvention | Flexible printed circuit board |
| abstract | (57) [Summary] (Modified) [Purpose] To improve the adhesion by jumper circuit, through-hole circuit and electromagnetic wave shield 7 to the circuit pattern to improve the conductivity and also the flex resistance. [Structure] The circuit pattern 1 contains magnesium and phosphorus, and contains at least two kinds of indium, tin, lead and antimony, and the balance is substantially copper, which is excellent in bending resistance and is superior to pure copper. It is formed from a copper alloy rolled and annealed foil that is comparable in conductivity. The electromagnetic wave shield 7 and the jumper circuit 6 are made of a conductive coating material which is surface-coated with titanate and contains metallic copper powder, a resol type phenol resin, a chelate layer forming agent, an adhesion improving agent, and a conductivity improving agent. The through-hole circuits 5a and 5b are formed of a conductive coating material which is surface-coated with titanate and which contains metallic copper powder, a resol type phenol resin, an amino compound, and a chelate layer forming agent. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015174207-A |
| priorityDate | 1991-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 82.