http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0529735-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_32df1f25edbf7933e35d2304d2190f77 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B7-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-24 |
| filingDate | 1991-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9569829cc450590c0eb5785ff0df3fe2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88f41b765436a32c3592ce20abdda622 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adf1af3e21beb45e97689e58b8c83526 |
| publicationDate | 1993-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0529735-A |
| titleOfInvention | Flexible printed circuit board |
| abstract | (57) [Summary] (Modified) [Purpose] The adhesion of jumper circuits, through-hole circuits, and electromagnetic wave shields to the circuit pattern is increased to improve conductivity, eliminate bleeding during printing, and improve flex resistance. Improve. [Structure] The circuit pattern 1 contains magnesium and phosphorus, and contains at least 2 of indium, tin, lead and antimony. It is formed from a copper alloy rolled annealed foil which contains seeds and whose balance is substantially copper and which has excellent bending resistance and is comparable in conductivity to pure copper. The electromagnetic wave shield 7 and the jumper circuit 6 are made of a conductive coating material which is surface-coated with titanate and contains metallic copper powder, a resol type phenol resin, a chelate layer forming agent, an adhesion improving agent, and a conductivity improving agent. The through-hole circuits 5a and 5b are formed of a conductive coating material which is surface-coated with titanate and which contains metal copper powder, a resole-type phenol resin, a thixotropic adjuster, an amino compound, and a chelate layer forming agent. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8006848-B2 |
| priorityDate | 1991-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 85.