http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0529733-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_32df1f25edbf7933e35d2304d2190f77 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0218 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B7-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-24 |
filingDate | 1991-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9569829cc450590c0eb5785ff0df3fe2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88f41b765436a32c3592ce20abdda622 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adf1af3e21beb45e97689e58b8c83526 |
publicationDate | 1993-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H0529733-A |
titleOfInvention | Flexible printed circuit board |
abstract | (57) [Summary] (Modified) [Purpose] The adhesion of jumper circuits, through-hole circuits, and electromagnetic wave shields to the circuit pattern is increased to improve conductivity, eliminate bleeding during printing, and improve flex resistance. Improve. [Structure] The circuit pattern 1 is composed of an alloy of Cr: 0.25 to 10% by weight and the balance of Cu and an unavoidable impurity in which the P content is limited to 100 ppm or less, and has excellent bending resistance and is superior to pure copper. It is formed from a copper alloy rolled annealed foil that is comparable in conductivity. Electromagnetic wave shield 7 and jumper circuit 6 Is formed of a conductive coating material containing a metal copper powder, a resol type phenol resin, a chelate layer forming agent, an adhesion improving agent, and a conductivity improving agent, the surface of which is coated with titanate. The through-hole circuits 5a and 5b are formed of a conductive coating material which is surface-coated with titanate and which contains metal copper powder, a resole-type phenol resin, a thixotropic adjuster, an amino compound, and a chelate layer forming agent. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4505700-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002076535-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105430878-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009218443-A |
priorityDate | 1991-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 81.