http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0529731-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B7-08
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filingDate 1991-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9569829cc450590c0eb5785ff0df3fe2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adf1af3e21beb45e97689e58b8c83526
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publicationDate 1993-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0529731-A
titleOfInvention Flexible printed circuit board
abstract (57) [Summary] (Modified) [Purpose] The adhesion of jumper circuits, through-hole circuits, and electromagnetic wave shields to the circuit pattern is increased to improve conductivity, eliminate bleeding during printing, and improve flex resistance. Improve. [Structure] The circuit pattern 1 has Zr 0.01 to 0.05% by weight, Cr 0.01 to 0.05% by weight, and the balance being substantially Cu, and is excellent in bending resistance and more conductive than pure copper. It is formed from a copper alloy rolled annealed foil that is comparable. The electromagnetic wave shield 7 and the jumper circuit 6 are made of a conductive coating material which is surface-coated with titanate and contains metallic copper powder, a resol type phenol resin, a chelate layer forming agent, an adhesion improving agent, and a conductivity improving agent. The through-hole circuits 5a and 5b are composed of metallic copper powder, resol-type phenol resin, thixotropic adjusting agent, amino compound, surface-coated with titanate, It is formed of a conductive paint containing a chelate layer forming agent.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100504518-B1
priorityDate 1991-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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