http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0529728-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B7-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
filingDate 1991-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adf1af3e21beb45e97689e58b8c83526
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9569829cc450590c0eb5785ff0df3fe2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88f41b765436a32c3592ce20abdda622
publicationDate 1993-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0529728-A
titleOfInvention Flexible printed circuit board
abstract (57) [Summary] (Modified) [Purpose] To improve the electrical conductivity by increasing the adhesion of jumper circuits, through-hole circuits, and electromagnetic wave shields to the circuit pattern, and to improve the bending resistance. [Structure] The circuit pattern 1 contains 3 or 4 kinds of indium, tin, lead and antimony, and the total content thereof is 0.02 to 0.15% by weight and the content of each is 0. Formed from a copper alloy rolled and annealed foil which has a bending resistance of 0.006% by weight or more and the balance of which is substantially copper, and has a conductivity comparable to that of pure copper. The electromagnetic wave shield 7 and the jumper circuit 6 are made of a conductive coating material which is surface-coated with titanate and contains metallic copper powder, a resol type phenol resin, a chelate layer forming agent, an adhesion improving agent, and a conductivity improving agent. The through-hole circuits 5a and 5b are composed of metal copper powder, resol-type phenol resin, whose surface is coated with titanate, It is formed of a conductive paint containing an amino compound and a chelate layer forming agent.
priorityDate 1991-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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