http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05295089-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_229fd6f7a62130a11fcb15a6e5ec8e77 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 |
| filingDate | 1992-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_016bc4108a710d35905a4acfde327272 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_96573f7f64d5cba92946a752922d4e33 |
| publicationDate | 1993-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05295089-A |
| titleOfInvention | Curable resin composition |
| abstract | (57) [Summary] [Structure] (a) A polyepoxy compound having at least two epoxy groups in one molecule, and (b) a general formula: (In the formula, n is an integer of 1 to 10, R is a hydrogen atom, and has 1 carbon atom. ~ 4 alkyl group or halogen atom, m is 0, 1 or 2, A'is a hydrogen atom or a methyl group, and one or both of A is a hydrogen atom or an optionally substituted glycidyl group). A curable resin compound comprising a compound, optionally a curing agent and a curing accelerator. [Effect] The curable resin composition of the present invention is excellent in both heat resistance and mechanical properties and can be used in various fields such as molding materials, paints, adhesives, laminating agents and sealants. .. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005092826-A1 |
| priorityDate | 1992-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.