http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05293966-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be92719b856db86c092cc233e9512ca2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B28D1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-16 |
| filingDate | 1992-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61630099e7564551a77eb3c8b2aca7b5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d62675daf345f57e5625e05d93d51cc9 |
| publicationDate | 1993-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05293966-A |
| titleOfInvention | Method for manufacturing thermal inkjet head chip |
| abstract | (57) [Abstract] [Object] The present invention relates to a method for manufacturing a thermal inkjet head chip, and when a large number of head chips are taken from a single substrate, the substrate is less susceptible to cracking and chipping or cracking. Besides, it is possible to prevent the occurrence of chips or cracks from the substrate side to the ejection port portion when forming the ejection port, and to manufacture a thermal ink jet head chip capable of forming a head chip with high yield and mass productivity. The purpose is to provide a method. A thermal ink jet is formed by forming a flow path through which ink passes on a substrate made of a single crystal material, on which a heat storage layer, a heating element, electrodes for energizing the heating element, and a protective layer are formed. In the head, when separating the substrate into a plurality of chips, a groove having a depth that does not reach the bottom surface of the substrate is formed in the thickness direction of the substrate in a direction substantially parallel to the crystal axis, and then cleaving the single crystal. It is configured to be separated into chips by utilizing. |
| priorityDate | 1992-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.