| abstract |
(57) [Abstract] [Purpose] To provide an epoxy resin molding material for semiconductor encapsulation, which has low stress and is excellent in package crack resistance during a soldering process. [Structure] Epoxy resin, compound having phenolic hydroxyl group, curing accelerator, dimethyl silicone oil having carboxyl groups at both ends and having an average degree of polymerization of 35 to 60, and epoxy resin reacted with triphenylphosphine as a catalyst And a filler containing 7/3 to 9/1 of a spherical fused silica having a maximum particle size of 128 μm or less and a horny fused silica having a maximum particle size of 64 μm or less in an amount of 83% by weight or more based on the entire composition. Become. |