http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05279497-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-00 |
| filingDate | 1992-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1993-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05279497-A |
| titleOfInvention | Method of modifying polyimide surface |
| abstract | (57) [Summary] [Structure] The present invention is a method for modifying a polyimide surface by subjecting the polyimide surface to an electric discharge treatment and then subjecting it to an alkali treatment. [Effect] According to the method for modifying a polyimide surface of the present invention, A printed wiring board that uses polyimide to easily and reliably improve the adhesion between polyimide and wiring metal, inorganic film such as Si 3 N 4 and SiO 2 , sealing resin, heat resistant resin such as polyimide, and substrate. , Greatly contributes to the improvement of reliability of electronic devices such as semiconductor elements and LSI mounting boards. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013151624-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8053082-B2 |
| priorityDate | 1992-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.