| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76819
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 |
| filingDate |
1993-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
1993-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H05275366-A |
| titleOfInvention |
Chemical-mechanical polishing method for forming buried and protruding tungsten plugs |
| abstract |
(57) [Summary] (Modified) [Objective] To provide a method of manufacturing a plug made of a conductive material such as tungsten that is more uniform and has no dents than before. [Structure] An insulating layer 10 having a contact opening 16 is formed, and a metal layer 14 is overlaid thereon. The polishing pad is rotated with respect to the wafer surface to remove the metal on the wafer surface using a slurry that acts on the metal. The metal in the contact opening 16 is recessed by the chemical action and the action of the fiber component. The next step is to remove the insulating material 10 from around the metal 14 using a slurry containing an acid or base that selectively acts on the insulating material. It also contains an abrasive material for polishing the surface so that the height of the metal is the same as the surface of the insulating layer. Removal of the insulating material continues until the plug slightly protrudes. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6740590-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6737348-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5786275-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6527818-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6361708-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6274480-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6184120-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9854756-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100442108-C
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003517720-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4750948-B2 |
| priorityDate |
1992-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |