| abstract |
(57) [Summary] [Structure] The present invention comprises (a) Au, Ag, Pd and Pt. A conductive powder containing at least one selected from the group: A photosensitive conductive paste containing (b) an acrylic copolymer having a carboxyl group and an ethylenically unsaturated group in a side chain, (c) a photoreactive compound, and (d) a photopolymerization initiator. Regarding According to the photosensitive conductive paste of the present invention, it is possible to surely form a fine pattern, and it is possible to surely prevent faint wiring patterns, vertical line width differences, and line width sagging. Further, since the wiring resistance can be reduced, it is possible to reduce the transmission loss at high frequencies of a communication device or the like. As a result, high reliability can be obtained, and miniaturization and high density of the high-density ceramic multilayer wiring substrate and hybrid IC can be realized. |