http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0526331-U

Outgoing Links

Predicate Object
classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K105-06
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10
filingDate 1991-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1993-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0526331-U
titleOfInvention Resin transfer mold
abstract (57) [Summary] [Purpose] To provide an inexpensive resin transfer molding die capable of preventing resin from leaking. [Structure] An annular elastic seal member 4 having an aluminum tape 5 adhered to one mold is provided outside the periphery of a cavity 3 formed by a mold 1 and a core mold 2. A parting surface P was formed with the mold. There is no need for high-precision machining of the parting surface, and there is no risk of resin leakage. Further, even if the resin enters, the mold release becomes easy.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010110937-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115135481-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009298088-A
priorityDate 1991-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID439271
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http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419589576
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268

Total number of triples: 19.