http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05261867-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C41-40 |
| filingDate | 1992-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1993-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05261867-A |
| titleOfInvention | Mold release material for molding and manufacturing method thereof |
| abstract | (57) [Summary] [Purpose] A mold release material that has good moldability during embossing, high temperature releasability and transfer gloss. A mold release material is provided with a support having an uneven embossed surface, and a resin composition layer comprising a radiation curable resin and a silicone resin along the uneven surface of the support. A mold release material, wherein 3 to 33% by weight of the resin composition constituting the resin composition layer is silicon. [Effect] At the time of embossing, the self-cleaning action of the silicone resin allows the embossing roll to be processed without being filled with irregularities, and a uniform pattern can be embossed for a long time. Due to the polymerization of acryloyl group, the film strength is high, the transfer surface has gloss, is not attacked by high temperature and solvent, and has good releasability. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006002264-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007098639-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8187695-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002292641-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005065937-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9085121-B2 |
| priorityDate | 1992-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.