http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05255860-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 |
| filingDate | 1992-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1993-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05255860-A |
| titleOfInvention | Pretreatment liquid for electroless copper plating |
| abstract | (57) [Abstract] [Purpose] To provide an adhesion promoter for electroless copper plating, which has excellent adhesion between the base copper foil and the plating, etching erosion, excellent plating reproducibility, and a long solution life. [Constitution] Sulfuric acid, F, I except for Cl, Br, and Br compound are components. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6994944-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7857960-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011104936-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2025778-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8796719-B2 |
| priorityDate | 1992-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.