Predicate |
Object |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C59-002 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K105-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K23-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-32 |
filingDate |
1992-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
1993-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-H05254066-A |
titleOfInvention |
Mold release material for molding and manufacturing method thereof |
abstract |
(57) [Abstract] [Purpose] Efficiently manufacture a mold release material that has good moldability, mold storability, and adhesiveness. [Structure] A mold release material in which an embossed polyolefin resin film and a non-embossed support are bonded by a radiation curable resin polymerized by ultraviolet irradiation or electron beam irradiation. [Effect] Since the support is not embossed, there is no return of the support due to moisture or heat. Also, since the embossed unevenness is supported by the radiation curable resin from the back side, the mold does not collapse during high temperature use and the mold preservability is good, and it can withstand repeated use many times. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015079926-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100404572-C http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100798206-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005025863-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I381938-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9085121-B2 |
priorityDate |
1992-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |