| abstract |
(57) [Summary] Suppress plating penetration in multilayer wiring boards. [Structure] A copper oxide having fine irregularities is formed on the copper surface by a method of bringing the copper surface into contact with an aqueous solution containing an oxidizing agent or a method of anodizing using an alkaline electrolyte, and then reducing the copper oxide. In the surface treatment method of copper, which is brought into contact with an agent and reduced to metallic copper, followed by washing and drying, hot water having a specific temperature is used as washing water after being reduced to metallic copper, and the drying temperature after washing with hot water is Be specific, or Dry after contact with a solution containing a copper corrosion inhibitor. |