patent/JP-H05243430-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05243430-A

Outgoing Links

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filingDate	1992-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b02e896038311caa850abcfdf87f8407 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e0846bd0cd5d665543595fd397ce0d4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_685c5de2fe7c80744785e2565aab0a12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71b64c60afc64fa4f9010388b76f27f7
publicationDate	1993-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	JP-H05243430-A
titleOfInvention	Cooling structure and chip package module
abstract	(57) Abstract: The present invention proposes a cooling structure that directly transfers heat between an active layer and a heat sink in a chip in which an electronic device is formed. A cooling structure 30 of the present invention includes a metal structure 43, 44, 45 and an insulating spacer 46 which are partially covered by an insulating layer 471 and then covered by a heat transfer structure 48. 1, 462, 463, 464 and / or a current / voltage supply level 34 with an insulating layer. Thermal connection of heat transfer bridge 251 to heat transfer structure 48 provides heat flow between the cooling structure and heat sink of the present invention.
priorityDate	1991-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 65.