| abstract |
(57) [Summary] [Object] An object of the present invention is to impart elasticity to a protruding electrode used for connecting an Al electrode or the like of a semiconductor element and a wiring electrode of a circuit board. [Structure] The bump electrode 10 has a structure in which a resin having a large number of holes inside and a metal film are formed on the surface of the resin. As a result, elastic force is applied to the bump electrodes, and electrical connection is made by the metal coating on the surface. [Effect] By forming the protruding electrode as described above, Since it is possible to give an elastic force to the connecting portion, the load applied at the time of bonding can be relaxed by this protruding electrode and a low weight connection can be made, so that it is possible to connect without damaging the semiconductor element, Further, since deterioration of the joint portion due to thermal strain can be improved, connection reliability can be greatly improved. Further, even if there is warpage or distortion of the circuit board or variations in the protruding electrodes, it can be absorbed if the thickness is approximately 2 to 5 μm, so that the degree of freedom in selecting the substrate and material is improved. |