http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05240907-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_db496c7f79f0dfbca146c6a7100e0992 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B25J19-02 |
| filingDate | 1992-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a48ff916f4ca51ef4a8fd1413c01e469 |
| publicationDate | 1993-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05240907-A |
| titleOfInvention | Semiconductor wafer pellet inspection method |
| abstract | (57) [Summary] [Purpose] In the inspection of 100% pellet products on a wafer, at the time of setup, unnecessary pressure on the bonding pad in the pellet 4 prevents the pad from being damaged, and Provided is an inspection method for recognizing non-contact with an inspection needle without making a defect determination when the inspection needle is separated from the pad for a reason. [Structure] An aluminum pad 7 provided on a scribe line of a semiconductor wafer 10, a card 5 with a needle 6 whose center is divided by an insulator, and a probe card 2 which can be fixed in height according to the card. The position of the pellet is recognized by aligning 6 with the aluminum pad 7. |
| priorityDate | 1992-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804 |
Total number of triples: 15.