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filingDate 1991-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6592be4e8e80769419396788c182420
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publicationDate 1993-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0524071-A
titleOfInvention New compound injection molding method
abstract (57) [Summary] [Structure] A resin composition consisting essentially of an epoxy resin and its latent curing agent is applied to the wall surface of a mold, and then a thermoplastic resin is injected into the mold cavity to form a thermosetting resin composition. A composite injection molding method of a thermoplastic resin coated with a thermosetting resin for curing an object. [Effect] Excellent surface hardness, heat resistance, flame resistance, chemical resistance, abrasion resistance, weather resistance and the like, which cannot be considered only by the thermoplastic resin, can be obtained.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9530707-A1
priorityDate 1991-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 32.