http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05239315-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cebc9740ef706cde29e885504f274ffa |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 1992-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_242ae4d93bac0b4445e6e53c0dc0bbdd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6cb2b5d71be951c3db163e0865fb5cf |
| publicationDate | 1993-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05239315-A |
| titleOfInvention | Epoxy resin composition for encapsulation |
| abstract | (57) [Summary] [Objective] To provide a highly reliable epoxy resin composition for encapsulation, which has low stress, good heat cycle property, moisture resistance, moldability and dispersibility, and further has excellent water absorption. . [Structure] 100 parts by weight of an epoxy resin (A) containing a curing agent and an inorganic filler and a graft copolymer (B) An epoxy resin composition for sealing comprising 0.1 to 20 parts by weight. The graft copolymer (B) is methyl methacrylate 70 to 99.9 in the presence of a latex of a butadiene rubber polymer obtained by emulsion polymerization of a monomer mixture containing butadiene as a main component and also containing aromatic vinyl. It is obtained by adding and polymerizing a monomer mixture consisting of 10% by weight, 0.1 to 10% by weight of a crosslinkable monomer, and a vinyl monomer. |
| priorityDate | 1992-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 69.