| abstract |
(57) [Abstract] [Purpose] A thermosetting resin composition having a high heat resistance, which is a resin composition having improved workability in heat molding by lowering the viscosity of the resin composition. I will provide a. [Structure] N, N '-(methylenedi-p-phenylene) From imide compounds (a) such as dimaleimide, 2,2-bis [4-hydroxy-3- (2-methyl-2-propenyl) phenyl] propane (b) and alkenylphenol compounds (c) such as 2-allylphenol Become 5 A low-viscosity thermosetting resin composition having a rotational viscosity at 0 ° C. of 50,000 cp or less. |