| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15312 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B38-08 |
| filingDate |
1992-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d9e0540fb8261aa72c514008512c5c5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28e9bb1bd9303374ac7e7cb8d27b1ad4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2cbd4536abdd36fceef1cb1c67f2ed8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38bbc0f8242bea64e03abded26ce66a5 |
| publicationDate |
1993-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H05238849-A |
| titleOfInvention |
Ceramic composite structure and manufacturing method thereof |
| abstract |
(57) [Abstract] [Purpose] To avoid swelling or void formation of copper conductors formed in ceramic multilayer circuits. Disclosed is a ceramic composite structure 2 having a porous silicon dioxide region 6 and a conductor pattern region in a sufficiently densified material, and a method for manufacturing the same. The porous silicon dioxide region 6 and the conductive region are substantially enclosed within the structure 2. This structure 2 is useful for an electronic packaging substrate. Placing a window frame-shaped layer of precursor to be a densified material on a green precursor layer to be a densified material for support, and then porosity inside the frame Structure 2 is manufactured by depositing the precursor material on silicon dioxide. Multilayer structures can be fabricated with conductors interposed or interposed between adjacent densified layers. The electrically conductive precursor and all layers are sintered at about the same time, with pressure preferably being applied. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022264725-A1 |
| priorityDate |
1991-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |