| abstract |
(57) [Summary] [Structure] In a pressure-sensitive adhesive tape for wafer dicing, a film made of a rubber-like elastic body having a Young's modulus of 10 -1 to 10 2 MPa and a dimensional recovery rate of 80% or more is used as a base film. To use. [Effect] The expanding step of the pressure-sensitive adhesive sheet, which is usually performed when picking up the chip, can be omitted. |