http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05222541-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate | 1992-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e148013da779fbad2e5438719864405b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a746dc74f470b6f4a0609abc6b956639 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80191d0c21c0ef27f26de542cc4d020e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f4f9957385e73f8c323502475d8c8c3 |
| publicationDate | 1993-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05222541-A |
| titleOfInvention | Gold plating method |
| abstract | (57) [Abstract] [Purpose] In the method of forming an electroless gold plating film on nickel, the thickness of the displacement gold plating film formed on nickel as a catalyst for electroless gold plating should be 0.1 μm or less. To improve the adhesion between nickel and gold plating film. [Structure] As shown in FIG. 1, the adhesion between nickel and the gold plating film tends to sharply decrease at a film thickness of 0.1 μm or more with respect to the thickness of the displacement gold plating film. Further, as a catalyst for electroless gold plating, the displacement gold plating film thickness is required to be 0.005 μm or more. Therefore, the displacement gold plating film thickness is 0.005 It is preferably 0.1 μm. [Effect] As a result, the adhesion between the nickel and the gold plating film is improved, the connection reliability of soldering, wire bonding, etc. is improved, and the manufacturing yield is also improved. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007239025-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6533849-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6136702-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160145533-A |
| priorityDate | 1992-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.