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filingDate 1992-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b37886a82579d29fe180f56636cf5674
publicationDate 1993-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05222504-A
titleOfInvention Method for manufacturing embossing die
abstract (57) [Summary] (Correction) [Structure] The photosensitive synthetic resin layer, which was exposed through a light exposure mask and developed to form irregularities on the surface, was coated with paper on the irregular surface in a non-adhering state to the tube. The outer side is wound, and the synthetic resin layer is sprayed with solder to form a solder sprayed layer. Next, the tube is pulled out, the paper and the synthetic resin layer are peeled off, and the metal is sprayed on the solder sprayed layer from the inside to form the metal sprayed layer 7. Next, the iron pipe 9 is inserted through the tubular metal spray layer 7, solder is poured into the space between the two, and the metal spray layer 7 is fixed to the iron pipe 9 by the solder layer 8. Next, the solder spray layer is melted and removed. In this way, the uneven surface of the synthetic resin layer is transferred to the inner peripheral surface of the solder spray layer, and further transferred to the outer peripheral surface of the metal spray layer 7, The embossing roll. [Effect] The embossing roll can be manufactured easily and at low cost without manual work requiring skill and labor. Furthermore, An uneven surface having gradation can be formed on the outermost metal spray layer of the embossing roll.
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