abstract |
(57) [Summary] [Object] To provide a low dielectric epoxy compound having excellent heat resistance and a composition thereof. [Structure] 4,4 '-[1,3-phenylenebis (1-methylethylidene)] bis [2,6-dimethyl] phenol diglycidyl ether compound (epoxy compound), and this epoxy compound and curing agent dicyandiamide The epoxy resin composition containing. |