| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D301-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-06 |
| filingDate |
1992-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a0c7e02b72c9d6a7dc53fe03d64f7d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_942b383291b422becabb8bb93575d571
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0611b4a1774ae47cf95599e7d1df00f9 |
| publicationDate |
1993-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H05222155-A |
| titleOfInvention |
Epoxy compound and composition thereof |
| abstract |
(57) [Summary] [Structure] [Chemical Formula 1] And an epoxy resin composition comprising the epoxy compound and a curing agent, and an epoxy resin composition comprising a curing agent and an adduct obtained by previously reacting the epoxy compound with bisphenol A. [Effect] A low-dielectric cured product having excellent heat resistance is provided, and it is particularly useful for laminated boards. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010111859-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08134175-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08325355-A |
| priorityDate |
1992-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |