http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0521914-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B7-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
filingDate 1991-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88f41b765436a32c3592ce20abdda622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adf1af3e21beb45e97689e58b8c83526
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9569829cc450590c0eb5785ff0df3fe2
publicationDate 1993-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0521914-A
titleOfInvention Flexible printed circuit board
abstract (57) [Summary] (Modified) [Purpose] To improve the electrical conductivity by increasing the adhesion of jumper circuits, through-hole circuits, and electromagnetic wave shields to the circuit pattern, and to improve the bending resistance. [Structure] The circuit pattern 1 is formed of a copper alloy rolled annealed foil containing Fe, P, Zr and In, the balance being copper, having excellent bending resistance and having conductivity comparable to that of pure copper. The electromagnetic wave shield 7 and the jumper circuit 6 are made of a conductive coating material which is surface-coated with titanate and contains metallic copper powder, a resol type phenol resin, a chelate layer forming agent, an adhesion improving agent, and a conductivity improving agent. The through-hole circuits 5a and 5b are formed of a conductive coating material which is surface-coated with titanate and which contains metallic copper powder, a resol type phenol resin, an amino compound, and a chelate layer forming agent.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9413585-B2
priorityDate 1991-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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