http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05216223-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_385752f237551ca1b257f160a0f2434b |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 1992-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e95f35111d8a2d3f9ee66f262cb3d467 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9a8f6f326338f14cba2af1743345cfd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1e603a23a872550cc04f35a141abf87 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f519d81ec210a874da48fa34359017c |
| publicationDate | 1993-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05216223-A |
| titleOfInvention | Radiation-sensitive resin composition |
| abstract | (57) [Abstract] [Purpose] Solubility in positive photoresist is high enough to prevent contamination of peripheral equipment and working environment due to sublimation of radiation absorbing material during prebaking, and to prevent halation and heat resistance. Provided is a radiation-sensitive resin composition which does not cause a significant decrease in sensitivity, resolution, pattern shape, residual film rate, focus tolerance and the like and is excellent in storage stability. [Constitution] Obtained by condensing an aldehyde with a compound selected from the group consisting of (a) an alkali-soluble resin, (b) a 1,2-quinonediazide compound, and (c) a specific hydroxybenzophenone and a specific hydroxychalcone. A radiation-sensitive resin composition comprising a resin as described above. |
| priorityDate | 1992-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 235.