| abstract |
(57) [Summary] [Structure] As the wiring interlayer insulating film 11 between the lower conductor layer 8 and the upper conductor layer 12, a polyamic acid is reacted with an amine compound having a hydroxyl group and an isocyanate compound having a carbon-carbon double bond. And a wiring structure using a cured product of a photosensitive polymer composition further containing a photosensitizer. [Effect] By using a photosensitive polymer composition with a highly sensitive photosensitive film and excellent mechanical properties of the cured product as a protective film, α-ray shielding film, and wiring interlayer insulating film, productivity and reliability are improved compared to conventional products. A wiring structure having excellent properties can be manufactured. |