http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05206610-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate | 1991-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1786ffba182fe7cb0c8a36bc8cf8241b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a54d74ad7acde2eadefbbbed80bdb3a8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d23e4b0713633de94224965576606dda |
| publicationDate | 1993-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05206610-A |
| titleOfInvention | Method for manufacturing printed wiring board |
| abstract | (57) [Abstract] [Purpose] The present invention relates to a printed wiring board by a resist electrodeposition method used in electric equipment, electronic equipment, computing equipment, and communication equipment, and its purpose is to form a uniform electrodeposition film. [Structure] When a constant current method resist electrodeposition is performed on a printed wiring board, by varying the current density in the state of a fine film and / or a thin film, abnormal film deposition can be prevented and a uniform electrodeposition film can be formed. It is a thing. |
| priorityDate | 1991-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 16.