http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05197159-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 1992-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fafbe833382bbc30babb4740273ad3d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5a475882a401694bdcd663be4185577 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c9dd112b2729526955413f3a348eda6 |
| publicationDate | 1993-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05197159-A |
| titleOfInvention | Method of forming polyimide pattern |
| abstract | (57) [Summary] The present invention relates to a method for forming a polyimide pattern on a copper wiring by using a polyamic acid type photosensitive polyimide precursor. Applying a coating liquid containing an organosilicon compound on the copper wiring and then drying it. B. Forming a film of a photosensitive polyimide precursor on the organosilicon compound film, C. Exposing and developing the precursor coating to form a pattern; D. Heating the precursor pattern to convert it to a polyimide pattern; E. A method of forming a polyimide pattern comprising the steps of removing the silicon dioxide film by treating the silicon dioxide film in the through holes of the polyimide pattern with an etching agent or plasma. [Effect] When a polyimide pattern is formed on copper wiring, a polyimide pattern without a residual film of development can be reliably formed, and electrical connection in a through hole formed on the copper wiring. Can solve the problem of poor continuity. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7947428-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105810567-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103380491-A |
| priorityDate | 1991-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 62.