| abstract |
(57) [Summary] [Purpose] U without peeling or swelling of the resist on the conductor circuit even when immersed in a high temperature, highly alkaline chemical copper plating solution. A V-exposure and development type solder resist is provided to facilitate the production of a high density printed circuit board by the part additive method. [Structure] A photosensitive solder resist composition having resistance to plating is a reaction product of an epoxy resin having an average of a plurality of epoxy groups per molecule and an unsaturated carboxylic acid. An unsaturated compound, another functional unsaturated compound which is liquid at room temperature and has a plurality of ethylene bonds per molecule, a photopolymerization initiator, an epoxy resin effect agent, melamine or its derivative or dicyandiamide, It contains an antifoaming agent, a pigment, and an organic solvent. |