http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05190998-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1992-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7724e2a6076727d924cdafb80784f8cc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_68b62c042785dba6dc51483e0324c1d0 |
| publicationDate | 1993-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05190998-A |
| titleOfInvention | Insulating material for wiring board and method for manufacturing multilayer wiring board |
| abstract | (57) [Abstract] [PROBLEMS] To provide an insulating material for a wiring board and a method for manufacturing a multilayer wiring board, which provide an insulating material having a low dielectric constant and excellent heat resistance, and which is suitable for high-speed signal processing. The purpose is to put into practical use. [Structure] An insulating material for a wiring board, which is cured by impregnating a void of a porous perfluoroethylene film with a thermosetting resin having a benzocyclobutene ring, is used, and a wiring layer and the above wiring board are provided on a rigid support substrate. A method for manufacturing a multilayer wiring board is characterized in that it is formed by alternately laminating insulating layers made of an insulating material. |
| priorityDate | 1992-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 17.