| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a1d6959d309c1b31c3080c4c5a096e33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0950e9df7f0e1b73efee1bda859951ad |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11C11-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 |
| filingDate |
1992-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f973d3ab6a01774f2aae5b6af0759f4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a9fb564ce25f444e3a2377f7427f2b0 |
| publicationDate |
1993-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H05190748-A |
| titleOfInvention |
Electronic component mounting package manufacturing method |
| abstract |
(57) [Abstract] [Purpose] To provide a simple and low-cost manufacturing method for manufacturing a mounting package of electronic parts so that a cutting margin does not protrude from a mold area. When the die pad support lead 214 is cut, the mold area 23 of the die pad support lead 214 is used instead of the press cutting according to the conventional manufacturing method. A half-cut line 217 having a reduced thickness is provided at a portion corresponding to the outer periphery of the die pad, and a shearing force or a bending force is applied to the portion of the half-cut line 217 after sealing with the molding material 104, whereby the die pad supporting lead 21 Cut 4. The half-cut lines 214 are provided so as to follow the line of the outer periphery of the mold area and ideally coincide with each other. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013025542-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9599655-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5883424-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104347611-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8927343-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8916957-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I479614-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015179737-A |
| priorityDate |
1992-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |