| abstract |
(57) [Summary] [Object] To provide a resin composition for semiconductor encapsulation, which is excellent in moldability and curing characteristics and has a low elastic modulus. [Structure] 10 parts by weight of polymaleimide, 10 to 10 parts of polyaminosiloxane represented by the following general formula (1): A resin composition comprising 50 parts by weight of an organic peroxide having a half-life at 180 ° C. of 0.2 to 2 minutes and 100 to 1500 parts by weight of an inorganic filler. (In the formula (1), R 1 is any one of CH 3 , C 6 H 5 , and R 4 NH 2 , and R 2 is R 5 NH 2 , R 5 NHR 6 NH 2 , CH 3 , C 6 At least one of R 1 and R 2 of either H 5 has an amino group. ) |