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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
filingDate 1991-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6308ae29b41a64608c5513a3527c8a4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26ab3e30208fb40cc8e04766b1eb8c67
publicationDate 1993-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05186684-A
titleOfInvention Polyamide resin composition
abstract (57) [Abstract] [Purpose] To provide a resin composition which imparts excellent friction and abrasion properties without impairing the various properties inherent to polyamide resins and is also excellent in moldability. A polyamide resin composition containing 1 to 30% by weight of high-purity spherical silica having an average particle size of 0.1 to 100 μm, or further containing 3 to 50% by weight of pitch CF.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008170012-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020202837-A1
priorityDate 1991-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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