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filingDate 1991-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_545ab069a1d0b17807b024864a9ba908
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publicationDate 1993-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05179209-A
titleOfInvention High thermal conductivity film adhesive that can be thermocompression bonded
abstract (57) [Summary] [Structure] An adhesive layer composed of a different or the same kind of high thermal conductive filler and an organic binder is provided on both sides of an inorganic film having a thermal conductivity of 50 [W / (m ยท K)] or more. A highly heat-conductive film-like adhesive capable of thermocompression bonding. [Effect] It is possible to obtain a tough thermocompression-bondable film-like adhesive having excellent thermal conductivity, heat resistance, and adhesiveness.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016000813-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10633559-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012033768-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105440960-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013515113-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103014593-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017153576-A1
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