| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-56 |
| filingDate |
1991-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f483f634a99128fcc48924d073b8642f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b30505b126fc7621a713a88d7ad08632 |
| publicationDate |
1993-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H05163331-A |
| titleOfInvention |
Epoxy resin composition |
| abstract |
(57) [Summary] [Object] To provide an epoxy resin composition which is excellent in both fast curing property and storage stability, due to a unique curing agent system of an epoxy resin. The present invention is a composition in which an epoxy resin contains, as a curing agent, dicyandiamide and two imidazole compounds having a melting point difference of 15 ° C. or more. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102807778-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0694571-A1 |
| priorityDate |
1991-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |