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filingDate 1991-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1993-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05160578-A
titleOfInvention Hybrid integrated circuit device
abstract (57) [Summary] [Purpose] The objective is to reduce thermal stress due to environmental temperature changes and improve long-term reliability. [Structure] The housing 2 for fixing a large number of terminals 3 is composed of a carbon fiber reinforced aluminum alloy.
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Total number of triples: 25.