http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05160299-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate | 1991-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ac2ed761be81df52b696edef35af6aa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d21ab067bb1fc35ba918fd6aa40d8cf |
| publicationDate | 1993-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05160299-A |
| titleOfInvention | Epoxy resin composition for optical semiconductor encapsulation |
| abstract | (57) [Summary] [Construction] An epoxy resin composition for semiconductor encapsulation, comprising 20 to 100% by weight of a total epoxy resin content of a polyfunctional alicyclic epoxy resin, and further comprising tetrahydrophthalic anhydride and 2-methylimidazole. [Effect] The heat resistance is improved as compared with the conventional resin composition for encapsulating an optical semiconductor, and the excellent light transmittance can be maintained even in a high temperature and high humidity atmosphere. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014073429-A1 |
| priorityDate | 1991-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.