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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-04
filingDate 1991-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de331036700da249c2c87e20ec00d205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5cf877e88f92460c3409922f75881c80
publicationDate 1993-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05152173-A
titleOfInvention Chip-shaped solid electrolytic capacitor
abstract (57) [Summary] [Structure] The solid electrolytic capacitor element in which the conductor layer forming portion and the anode portion are formed is connected to the convex portion of the lead frame, and the conductor layer forming is connected to the convex portion of the lead frame. A chip-shaped solid electrolytic capacitor in which a metal foil is attached to the opposite surface of the part and sealed with an exterior resin. [Effect] A solid electrolytic capacitor with good leakage current.
priorityDate 1991-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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